Crystal low-temperature soldering process with ultra-high reliability flip-chip COB package provides better common cathode energy-saving heat dissipation platform COB package can design more unique "display optics" characteristics COB realizes "point" light source to "surface" light source convert
Crystal low-temperature soldering process with ultra-high reliability flip-chip COB package provides better common cathode energy-saving heat dissipation platform COB package can design more unique "display optics" characteristics COB realizes "point" light source to "surface" light source convert