Indoor product series
COB series
COB series

Crystal low-temperature soldering process with ultra-high reliability flip-chip COB package provides better common cathode energy-saving heat dissipation platform COB package can design more unique "display optics" characteristics COB realizes "point" light source to "surface" light source convert

Overview

Crystal low-temperature soldering process with ultra-high reliability flip-chip COB package provides better common cathode energy-saving heat dissipation platform COB package can design more unique "display optics" characteristics COB realizes "point" light source to "surface" light source convert

Product parameters
  • Model :
    Display area:
    Backlight :
    Brightness :
    CPU :
  • Resolution :
    Contrast :
    Responding speed :
    Color :
    Point distance :
  • Power :
    Built-in memory system:
    Input voltage:
    Product Size:
Product Details


Customer case